Interconnection development for InP-HBT terahertz circuits
| Главный автор: | |
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| Формат: | Licensed eBooks |
| Язык: | английский |
| Опубликовано: |
Göttingen :
Cuvillier Verlag,
2020.
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| Серии: | Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik.
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| Online-ссылка: | https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=2471449 |
Оглавление:
- Intro
- 1. Introduction
- 2. InP HBT transferred-substrate process
- 3. Plasma etching of benzocyclobutene
- 4. Nickel chrome thin film resistors
- 5. Through silicon vias in atransferred-substrate process
- 6. Summary
- List of Figures
- List of Tables
- Bibliography
- Appendix A Publications
- Appendix B Acronyms